Package Design and Layout Engineer, Lightmatter
$175-215k
Plus Stock Option Plan
Light-powered AI computing
Open for applications
Light-powered AI computing
101-200 employees
Open for applications
$175-215k
Plus Stock Option Plan
101-200 employees
Company mission
Lightmatter's mission is to build an engine that will power discoveries, drive progress, and redefine what computers and human beings are capable of.
Role
Who you are
- Bachelor's degree in Electrical Engineering or similar discipline with at least 8 years of relevant experience
- Minimum 7 years of experience in designing IC package substrate layouts
- Experience with Cadence APD+ as the primary layout tool
- Good understanding of the IC package substrate and organic materials, and how they will impact package design
Desirable
- Educational background on IC packaging and substrate layout design
- Familiarity with Cadence Integrity 3DIC for package/IC codesign
- Familiarity with layout tools e.g. Expedition Package Designer, Pads Layout, Altium, etc
- Experience with various layout tool scripting languages, e.g. SKILL or Python to enable design automation
- Demonstrated excellent communication skills and ability to collaborate effectively in cross-functional teams
- Proven history of meeting time commitments and deliverables
What the job involves
- As a Package Design Engineer at Lightmatter, you will be designing complex substrates and interposers
- Lightmatter will always be on the leading edge of the technology, expanding beyond the traditional laminate materials, moving toward materials like silicon, glass, and ceramics
- At Lightmatter, we hire the best of the best and allow you the autonomy to plan and execute your designs to meet the timelines and objectives using your past experience in the industry to successfully deliver these complex package layouts
- These products will be used in one of the highest growing segments in the semiconductor industry and will let Lightmatter maintain its leading position in the silicon photonics technology
- Deliver IC package substrate layouts for various advanced packaging technologies
- Actively participate in the product concept phase to deliver preliminary substrate design and floorplanning to help drive overall stack up (Silicon/package/MB) optimization
- Work with package substrate suppliers along with Outsourced Semiconductor Assembly and Test (OSAT) companies to understand layout design rules, stack up, and implementation
- Create fab files, work with substrate suppliers, and OSATs to close design for manufacturing (DFM) / design for assembly (DFA)
- Design complex package layout keeping in mind signal integrity, power integrity, thermal and mechanical requirements
- Demonstrated ability in designing packages with analog and digital elements/interfaces
- Support signal/power integrity engineers by providing iterative test routes to refine design rules and routing topologies
- Project Management skills to coordinate and collaborate across multiple functional teams to ensure error free Package design Tape Out in a timely manner
- Drive design automation & verification activities
Our take
Neural networks and CPUs are vital to AI solutions, but manufacturers have largely failed to maintain innovation in recent years. Lightmatter solves this problem by offering a next-generation computing platform powered by photonics (light waves).
Lightmatter offers a forward-facing platform for AI-building that acts as an alternative to traditional solutions. It works by replacing wired CPUs with a combination of photonics and new algorithms. Lightmatter's solution is not only faster, but it is considerably more sustainable, and it has the potential to drive the next generation of AI development.
As of 2022, Lightmatter has raised $113 million across three funding rounds, which is testament to growing industry demand for faster, more effective AI-building solutions. Lightmatter currently has three products on the market - Envise, Passage, and Idiom - and is poised to take on the incumbent chiplet industry with a photonics-based alternative.
Steph
Company Specialist
Insights
Some candidates hear
back within 2 weeks
Company
Funding (last 2 of 5 rounds)
Dec 2023
$155m
SERIES C
Jun 2023
$154m
SERIES C
Total funding: $422m
Company benefits
- Commuter benefit
- Happy hour -Spend time together and build friendships
- Generous vacation policy and holidays
- 401(K)
- Opportunity to learn from your peers and teach them what you know across electronics, photonics, machine learning, and more
Company values
- WORK WIDE & PARALLEL: Working on hard problems, we have to go down many different paths quickly to find the right one.
- QUESTION EVERYTHING: People have opinions about what things work and what things don’t work. They’re not always right.
- LET FIRST PRINCIPLES GUIDE YOU: Stand behind statements that you know are true and build something amazing.
- DON'T BE DEFINED BY YOUR JOB TITLE: Many great ideas occur at the boundaries between disciplines.
- BE KIND: Help build the environment you want to work in.
- TAKE RESPONSIBILITY FOR YOUR WORK: Everyone’s contributions are critical to the company’s success.
Company HQ
Financial District, Boston, MA
Articles
Leadership
Nicholas Harris
(CEO)Previously worked as an R&D Product Engineer at Micron Technology, and as a Postdoctoral Fellow at MIT.
Thomas Graham
(COO)Was an M&A Analyst at Morgan Stanley, and worked as an Agency Business Development Manager at Google.
Darius Bunandar
(Chief Scientist)Worked as a Research Collaborator at Caltech, and was a PhD Candidate at MIT.
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